AYF33
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
? Speci?cations for taping
? Speci?cations for the plastic reel
Tape I
(A ± 0.3)
Tape II
(A ± 0.3)
(In accordance with EIAJ ET-7200B.)
(B)
(1.75)
28.40
(B)
(1.75)
(C ± 1)
Taping reel
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Label
? Y3B Dimension table (Unit: mm)
Number of pins
7 to 17
21 to 45
51, 61
Type of taping
Tape I
Tape I
Tape II
A
16.00
24.00
32.00
B
7.50
11.50
14.20
C
17.40
25.40
33.40
Quantity per reel
5,000
5,000
5,000
? Y3BW Dimension table (Unit: mm)
Number of pins
11
25
51
Type of taping
Tape I
Tape I
Tape II
A
16.00
24.00
32.00
B
7.50
11.50
14.20
C
17.40
25.40
33.40
Quantity per reel
5,000
5,000
5,000
? Connector orientation with respect to embossed tape feeding direction
Type
Direction
of tape progress
NOTES
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.3 mm or 0.5 mm.
In order to reduce solder and ?ux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The ?gures to the right are recommended
metal mask patterns. Please use them as
a reference.
Y3B
? Y3B
No. of pins: Odd number
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.60 ± 0.03
0.23 ± 0.03
0.23 ± 0.03
0.60 ± 0.03
Recommended metal mask pattern
Metal mask thickness: When 120 μ m
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60 ± 0.01
0.22 ± 0.01
0.22 ± 0.01
0.60 ± 0.01
Y3BW
No. of pins: Even number (8 pins)
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.60 ± 0.03
0.23 ± 0.03
0.23 ± 0.03
0.60 ± 0.03
Recommended metal mask pattern
Metal mask thickness: When 120 μ m
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60 ± 0.01
0.22 ± 0.01
0.22 ± 0.01
0.60 ± 0.01
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB47E 201303-T
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